Delta Electronics (Americas) Ltd. has an opening for a power electronics R&D engineer in their IT power team aimed at developing cutting-edge high-power density and high efficiency power converters for datacenter, server, and telecom applications at its Power Electronics Laboratory, located in Research Triangle Park, NC. ( ).

Key Responsibilities

• Design and develop high power density and high efficiency power conversion solutions for datacenter, server, and telecom applications.
• Research and implement two-level and multilevel power factor correction topologies, including both hard-switching and soft-switching techniques.
• Develop and optimize dual-active-bridge (DAB) and resonant DC-DC topologies.
• Work on single-stage AC-DC topologies, including resonant and DAB configurations.
• Explore and implement new bidirectional devices like bi-GaN and bi-SiC in various applications such as Vienna rectifiers, Current Source Inverters (CSI), and single-stage isolated AC-DC converters.
• Design high power density and highly efficient magnetics.
• Collaborate with cross-functional teams to ensure seamless integration of new technologies into existing and new products.
• Conduct simulations (PSIM, PLECS, Simplis, ANSYS, Matlab/Simulink) and prototype testing to validate design concepts and ensure performance meets required specifications.
• Stay up to date with the latest advancements in power electronics.
• Prepare technical reports, presentations, and documentation to communicate findings and support product development.

Qualifications

• M.S. degree with 5 years of relevant experience or Ph.D. degree in Electrical Engineering
• Proven experience in power electronics design and development, specifically in high efficiency and high-power density designs.
• Strong knowledge of two-level and multilevel power factor correction topologies (both hard-switching and soft-switching).
• Expertise in DAB and resonant DC-DC topologies.
• Experience with single-stage AC-DC topologies (resonant and DAB).
• Proficiency in working with wide band gap devices such as SiC and GaN.
• Familiarity with new bidirectional devices (bi-GaN and bi-SiC) and their applications.
• Experience with hardware design and testing, including PCB layout and thermal management.
• Hands-on experience with simulation tools such as MATLAB/Simulink, PLECS, or similar.
• Excellent problem-solving skills and the ability to work independently and as part of a team.
• Strong communication skills, both written and verbal.
• Prospective candidates should possess excellent analytical, organizational, interpersonal, and communication skills (fluency in Mandarin is preferred).
• Preference will be given to U.S. citizens and permanent residents.