Job Description:

IC/Assembly package engineering, focusing on Design and Development of High voltage leaded and leadless Packages. This position also needs supporting of sustaining/manufacturing efficiency for high volume assembly.

• Design and develop high voltage packages with AutoCAD and Thermal simulation software
• Work with leadframe, assembly suppliers and equipment manufacturers to develop the packages
• Develop assembly bills of material by working with material suppliers to support product reliability and product performances
• Develop and maintain efficient documentation system used to specify the manufacturing requirements for assembly of products
• Monitor assembly production yields, following up with assembly subcontract suppliers to address yield problems as well as opportunities for improvement
• Coordinate projects at subcontract suppliers to reduce cost and increase productivity for products
• Occasional international travel for subcontractor support and development

Requirements:

• Bachelor of Science in Mechanical. Electrical, Material Science. Manufacturing Engineering, or equivalent

Location:

Silicon Valley, San Jose, CA

Salary Range:

$150,000 - $200,000 (open to negotiation)

Required and preferred qualifications include:

• 5+ years of experience in IC assembly or package engineering role
• Thorough knowledge of IC assembly production processes
• Thorough knowledge of assembly materials
• Experience with AutoCAD or other CAD systems
• Mechanical drafting experience or training
• Statistical Process Control (SPC) experience or training
• Design of Experiments (D.O.E.) experience or training
• Microsoft software experience, including Word, Excel, Outlook, Access, PowerPoint
• Excellent communication and writing skills

Qualifications that would also be very helpful include:

• Knowledge of materials used in semiconductor manufacturing and semiconductor assembly
• Drafting using Geometric Dimensioning and Tolerancing (GD&T)
• Finite Element Analysis modeling (thermal and mechanical)
• Understanding of semiconductor reliability principles
• Knowledge of IC package types used in the semiconductor industry
• Knowledge of IC packing methods