Location: Sunnyvale, CA

Responsibilities:

• Design, simulate and validate advanced RF/mmWave/IPD solutions from prototype to mass production.
• Partner with 3rd party vendors to manufacture and qualify the RFmmWaveF package with high yield.
• Ensure seamless integration of the RF packages into our system, including reliability and manufacturability.
• RF lab debug, tuning and characterization of RFmmWave packages.
• Understand vendor's technology/capabilities and down-select suitable vendors for implementation.

Minimum Qualification:

• BSEE or MSEE in Electric/Electronic Engineering with at least 5 years of RF/mmWave packaging engineer.
• Excellent knowledge/experience in the following area: wafer level packaging, including RDL design, Silicon/LTCC/TFS passive design, including IPDs, FEM package design, SAW/BAW filters package design, or mmWave package design, including design of mmWave components on substrate.
• Excellent knowledge/experience of RF/mmWave measurement techniques and lab equipment, including load pull techniques and RF/mmWave probe station.
• Good understanding of wireless standards and compliance requirements (e.g. FCC).
• Excellent understanding of RF concepts such as power and noise matching, Smith charts, coupling, supply isolation, radar, de-sense, power supply rejection, transmission lines and mmWave components (e.g. coupler, filters, etc.)
• Experienced in developing test plans, test procedures, and compliance matrices.
• Familiar with circuit simulation tools (e.g. ADS), EM tools (e.g. HFSS), PCB design and layout tools (e.g. Allegro), and scripting languages (e.g. Python).
• Knowlege of wireless standards and wireless systems (e.g. WiFi/BT, Radar, Cellular, GNSS, UWB)
• Excellent verbal and written communication skills, interpersonal skills, problem solving skills, and team player.