As the Director, Field Applications Engineering, you will lead the Field Applications Engineering team supporting Tier 1 customers across North America. Your team will collaborate with sales and marketing to understand customer requirements and support design activities. You will work closely with global partners and assist customers in integrating 802.11ah chips into a variety of high-end IoT products. Additionally, you will interact regularly with design teams to help with hardware and software debugging.

Key Responsibilities:

• Manage Tier 1 Customer Support journeys and related performance metrics
• Develop and implement processes to improve support efficiency and customer satisfaction
• Prioritize and manage resources across customers and FAE teams
• Drive customer and market requirements into engineering, including product documentation, software, and ecosystem enablement
• Collaborate with customers, sales, and product management to gather and prioritize requirements
• Translate customer needs into actionable product specifications and roadmaps
• Ensure alignment between customer expectations and product development
• Lead training initiatives for internal sales, field application engineers, external sales reps, and distribution partners
• Create and deliver training materials to enhance technical knowledge and sales capabilities
• Support FAEs and sales teams during customer evaluations and product integration
• Provide technical guidance and solutions to ensure successful product integration
• Act as a liaison between customers and internal teams to drive product adoption and satisfaction
• Assist with design reviews, chip integration, and hardware/RF-related debugging and testing

Required Skills and Experience:

• BSEE or equivalent
• Minimum of 15+ years of experience in the semiconductor industry
• Proven experience in a B2B client-facing role, managing a high-performing team
• Strong ability to develop relationships cross-functionally and lead with influence
• Excellent communication, analytical, and strategic thinking skills
• Experience in building products from concept to production
• Familiarity with embedded software and RF networking (e.g., 802.11 series standards)
• Strong project management skills
• Experience translating customer requirements into project scope
• Ability to work effectively in a fast-paced environment
• Willingness to travel (25% travel required)

Please apply here with your updated resume or send directly to