• Provides timely and accurate root-cause analysis of products (IC’s, System-in-Package, and filters) using electrical and physical failure analysis techniques.
• Supports Failure Analysis Engineers and works with cross-functional teams (Manufacturing, Quality, Reliability, Design, etc.) to solve problems arising from customer returns, process anomalies, engineering evaluations, and new product development.
• Communicates analysis results through formal, technical report writing.
• Collaborates with internal and external laboratories as needed.
• Meets failure analysis cycle-time requirements.

Critical knowledge and abilities:

• Strong knowledge and experience utilizing physical failure analysis techniques for IC’s and PCB’s including cross-sectioning, parallel lapping, Reactive Ion Etching, decapsulating, X-ray analysis and chemical deprocessing.
• Experience utilizing optical and scanning electron microscopes including EDX (Energy Dispersive X-ray) analysis.
• Ability to troubleshoot electrical failures by micro-probing and using electrical test equipment.
• Adept at I/V curve-tracing using analog and multi-pin, digital curve tracers (RTI).
• Experience building evaluation boards by interpreting schematics and soldering components.
• Demonstrated proficiency utilizing MS Word, Excel, photo-editing, schematic and IC layout software.
• Familiar with FA techniques in order to effectively direct external lab’s: EMMI, FIB, CSAM, OBIRCH, TIVA, LIVA, etc.
• Able to write concisely using good spelling, grammar, and proofreading skills.
• Must be highly organized with a strong attention to detail. Must be able to manage multiple, concurrent assignments under tight deadlines.
• Able to follow instructions, maintain priorities, and make good decisions with minimal supervision.
• Has an FA mindset understanding FA processes, flow, and decision tree.
• Familiar with IC packaging, semiconductor processes, and PCB manufacturing.
• Experience working within an ISO-9001 work environment is a plus.

Qualifications:

• 5+ years of relevant Failure Analysis experience in the semiconductor or PCB industry.
• Associate degree or technical certification in Electronics.
• Excellent interpersonal and communications skills.