DFM Engineer

job
  • ATR International
Job Summary
Location
Cupertino ,CA
Job Type
Contract
Visa
Any Valid Visa
Salary
PayRate
Qualification
BCA
Experience
2Years - 10Years
Posted
14 Jan 2025
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Job Description

Cupertino, CA

12-month contract


You will be working with many internal teams and contract partners, leading package integration and architecture efforts.


• Work with 3rd party and OSAT to bring packaging solution from concept to HVM

• Drive industry with advanced package solutions and specs


DFM PCBA Engineers at the client specialize in high-quality, reliable electronics manufacturing. The client’s team focuses on the "New Product Introduction" (NPI) process, which involves taking a product from proof of concept through to mass production.


In this role, you will be assigned to a product and will be responsible for ensuring its manufacturability by applying the client’s design guidelines. This includes building the assembly process and designing the PCB panelization. You will use structured problem-solving and data analysis methods to address issues as they arise. Additionally, you will share new discoveries with your peers and contribute to innovation by filing patents for any novel ideas you develop.


To create the best products, you’ll collaborate with specialists from various teams within the client organization, including Product Design, EE, PCB Layout, Program Office, Reliability, TPM, Component Quality, Capex, and more. You will need to communicate frequently and effectively with both your peers and leadership teams to keep them updated on the status of your product. Additionally, you will provide in-person or remote support to the factory and regional teams when the product is being built.


Key Qualifications:

Desire for a candidate with PCBA assembly experience in the aerospace field . Hands-on experience with conformal coating, staking, and PbSn soldering preferred.


  • The PCBA DFM Engineer or Technologist will have a deep level of creativity and curiosity about materials science and electronics packaging at all levels.
  • 3+ years of research or process development experience in an applicable field.
  • Familiarity with the properties and process used in microelectronics fabrication and PCBA assembly.
  • Aptitude to work with a multi-functional team to define requirements and suitable metrics for the performance of new products and processes.
  • Proven ability to self-manage and deliver results in a pure development role.


Required skills:

  • PCBA Assembly experience
  • Aerospace design industry experience
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