Job Overview

MediaTek is seeking a talented and experienced technical leader with expertise in advanced packaging technologies, specifically 2.5D/3D. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal Integrity, Power Integrity, Thermal, product engineering, Test engineering, etc. The goal is to develop innovative packaging solutions for automotive, datacenter/HPC, and computing applications.

The ideal candidate will be instrumental in developing key packaging technologies, establishing third-party relationships, and addressing challenges in areas such as 2.5D/3D package integration, including but not limited to CoWoS, EMIB, SoIC, HBM, FCBGA, and HBPOP. The candidate should demonstrate ownership, high standards, strategic thinking, and customer obsession.

Role and Responsibilities

• Collaborate with internal teams, external customers, and key partners to develop advanced packaging solutions from concept to mass production
• Coordinate with package design, substrate, and assembly partners to select materials and BOM, ensuring manufacturability and meeting electrical, mechanical, thermal, and system-level requirements
• Lead and coordinate projects across design, engineering, supply chain, manufacturing, and quality assurance to ensure successful execution
• Establish and maintain strong relationships with suppliers, customers, and internal teams to meet project requirements and resolve supply chain or manufacturing issues
• Monitor and report on project progress, supply chain performance, and manufacturing metrics to senior management

Required Skills and Experience

• Expertise in 2.5D/3D package architecture and advanced packaging technologies such as CoWoS, EMIB, SoIC, CoW, WoW, POP, etc.
• Working knowledge of package design, electrical signal integrity, power integrity, thermal, and thermomechanical principles, with a fundamental understanding of 2.5D/3D package challenges
• Experience with wafer level processes, package assembly processes, and substrate technology.
• Strong supply chain and quality management skills, including BOM management, procurement, logistics, and inventory
• Understanding of legacy packaging technologies, package failure mechanisms, and quick problem-solving skills
• Ability to develop and maintain strong relationships with key enablement partners and customers, ensuring smooth communication and alignment on project requirements, product quality, reliability, system, and operational needs
• Excellent communication skills
• 10-15% international travel required

Salary range: $180,000 - $250,000

Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Paid time off (PTO), Parental leave, 401K and more.

MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.