Location - San Jose, CA

Skills - Mechanical Engineer

Responsibilities

• Mechanical Design: Create and optimize the mechanical design of components and chassis for rack mounted computing and communication systems, including enclosures, chassis, air and liquid cooling systems and mounting structures for electrical and optical components, ensuring optimal performance, reliability, structural integrity, manufacturability, and thermal performance.

• Packaging Design: Create and optimize the mechanical design of IC packages considering factors

such as thermal management, electrical performance, mechanical integrity, and

manufacturability. Development of advanced packaging technologies (SMT, solder ball

attach, and other assembly process) roadmap for networking products

applications. Photonics integration preferred. Perform design analysis and

what-if scenarios for novel packaging next generation technologies like Liquid cooling and Mechanical Design of robust package substrates.

• Material Selection: Choose appropriate

materials for IC packaging based on their thermal, mechanical, and

electrical properties to meFet performance requirements and reliability standards. Work

with internal silicon, architecture and

system teams and externally engaged partners, ODM, design houses and OSAT

companies

• Simulation and Analysis: Conduct simulations and analyses (e.g.,

finite element analysis, thermal analysis) to predict and optimize the structural integrity and thermal performance of electrical and

optical packages under various conditions.

• Prototyping and Testing: Develop prototypes of system chassis and electrical/optical packages, conduct

testing (e.g., thermal cycling, vibration testing) to validate designs, and

iterate based on test results.

• Collaboration: Work closely with electrical engineers,

semiconductor designers, and manufacturing teams to integrate electrical and optical packages into

overall product designs and ensure compatibility.

• Documentation: Prepare documentation including design

specifications, test procedures, and reports to communicate design concepts and

results.

• Quality Assurance: Ensure compliance with industry standards

and regulations related to system chassis and electrical/optical packaging and implement quality

assurance processes.

Qualifications

• BS in Materials Science, Mechanical Engineering or equivalent industry experience

• 10+ years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing

• In-depth knowledge of air and liquid cooling systems, flip chip, 2.5D and 3D packaging technologies including prior experience with TSV;s. Photonics package integration preferred.

• Experience taking products from concept to production including development of manufacturing specifications, vendor qualifications and improvement of manufacturing efficiencies and costs

• Effective communication skills. Experience working effectively with cross-functional teams

• CAD Tools: Proficiency in CAD software (e.g., SolidWorks, AutoCAD) for 3D modeling and design

• Effective communication skills. Experience working effectively with cross-functional teams

• Simulation Software: Experience with simulation tools (e.g., ANSYS, COMSOL) for analyzing thermal and mechanical behavior.