About the role:

Lead the mechanical design and development of next generation, high-capacity networking systems for emerging AI infrastructures

Responsibilities:

• Design and deliver next generation chassis and line cards
• Perform detailed 2D tolerance analysis for complex electro-mechanical assemblies using spreadsheet and/or 3D tolerance analysis tools
• Design and develop innovative mechanical solutions using sheet metal, injection-molded plastic, die-cast, extrusion process that meets EMI, safety and compliance requirements
• Develop 3D CAD models using Creo (preferred) Windchill for PDM or Solidworks
• Produce board outline drawings and set up ECAD (emm/emp) flow by establishing keep out component, height, trace and via restriction areas for PCB layout designers
• Structure and generate product documentation, such as BOMs, part numbers and ECOs
• Collaborate with thermal engineers to design and implement cooling solutions
• Experience with designing cooling systems for liquid-cooled and force-cooled network equipment

Requirements:

• BS/MS/PhD in Mechanical Engineering and 10+ years of experience in related Telecom and Datacenter product development
• Experience with EIA, ETSI or OCP rack standards
• Working knowledge of designing with connectors, such as OSFP/QSFP-DD/OSFP-XD for front-panel and orthogonal back-plane connectors
• Knowledge of MSA standards and optical cage form factors
• Strong understanding of tolerancing and tolerance loops
• NEBS knowledge is a plus