I'm seeking a Process Engineer to join a semiconductor manufacturing business based in Torrance, CA. This position is primarily responsible for overseeing and improving the wafer scribe and break processes within the facility. Key responsibilities include:

• Process Control and Development: Manage and optimize the wafer scribe and break module processes, including wafer mounting, scribing, breaking, cleaning, expansion, die picking, and thickness verification.
• Operator Training: Develop and deliver training programs for operators to ensure proper handling and processing of wafers.
• Documentation Upkeep: Maintain accurate and detailed documentation of all processes and procedures.
• Tool Ownership: Take ownership of scribe and break tools, assist EQUIP technicians with troubleshooting, and act as the primary contact for vendors.
• Support Backend Processes: Assist with various backend processes such as incoming inspection, wafer cleaning, defect identification, and other tasks as needed by the backend module manager.

Job Requirements:

• Education: Bachelor's Degree (BS) from a four-year college or university, or an equivalent combination of education and experience.
• Experience: At least 1 years of industrial experience and/or training in wafer scribe and break processes, particularly with GaAs and InP substrates.
• Hands-on experience in clean room environments and wafer processing.
• Strong knowledge of automated optical inspection and wafer scribe/break or sawing processes.
• Proficiency with development software, Microsoft Office, and Eyelit.