Job Description:

The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.

Skill sets required not limited to the following:

• Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board are preferred. Knowledge of packaging material property and behavior is beneficial.
• Candidate must also demonstrate good verbal and technical writing skills, work well with a team, deliver under pressure, and well organized.
• Minimum educational qualificatio n is an AS degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development.